Fine Particle Spherical Silica

Micron, for the first time in the world, met the need for high-performance encapsulation material by the development of producing ceramic spherical fine particle by flame spray method .
By high sphericity and high purity, our products have since steadfastly protected the reliability of semiconductors which are growing increasingly high in density and function.
Our products are available in a wide variety tailored to each customer’s requirements through adjustment of particle size distribution to suit the intended purpose.
 
Characteristics
High purity (non crystal silica)
High sphericity (high roundness)
High flowability
High filling density
Low thermal expansion ratio
Electrical insulation property
Low water absorption property
 
Application
Semiconductor encapsulation material filler
Coating materials
Filler material for various kinds of resin

Download products specification here.fine-particle-spherical-silica





For more information, please contact Kou Ebisawa at Tel +1-212-221-7890 ext 231 kebisawa@sanyocorp.com
or by using this form.

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