Micron, for the first time in the world, met the need for high-performance encapsulation material by the development of producing ceramic spherical fine particle by flame spray method . 

By high sphericity and high purity, our products have since steadfastly protected the reliability of semiconductors which are growing increasingly high in density and function. 

Our products are available in a wide variety tailored to each customer’s requirements through adjustment of particle size distribution to suit the intended purpose. 

Characteristics 

• High purity (non crystal silica)
• High sphericity (high roundness)
• High flowability
• High filling density
• Low thermal expansion ratio
• Electrical insulation property
• Low water absorption property

Application 

• Semiconductor encapsulation material filler
• Coating materials
• Filler material for various kinds of resin