Fine Particle Spherical Silica
Micron, for the first time in the world, met the need for high-performance encapsulation material by the development of producing ceramic spherical fine particle by flame spray method .
By high sphericity and high purity, our products have since steadfastly protected the reliability of semiconductors which are growing increasingly high in density and function.
Our products are available in a wide variety tailored to each customer’s requirements through adjustment of particle size distribution to suit the intended purpose.
Characteristics
● High purity (non crystal silica)
● High sphericity (high roundness)
● High flowability
● High filling density
● Low thermal expansion ratio
● Electrical insulation property
● Low water absorption property
Application
●Semiconductor encapsulation material filler
●Coating materials
●Filler material for various kinds of resin
Download products specification here.